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Thank you, @Olin, for your response! Regarding the SM expansion around the pad - this is a good input, I wasn't sure about it. Regarding SM sliver, I am working with PCBWay, and unfortunately, I ...

posted 13h ago by Eyal78‭ · edited 13h ago by Eyal78‭

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#2: Post edited by

Eyal78‭ · 2025-01-30T08:47:03Z (about 13 hours ago)

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Thank you, @Olin, for your response!
I am working with **PCBWay**, and unfortunately, I haven't been able to fully understand their capabilities for the **cheapest board option** (which I assume is their "Standard" service). Their website seems somewhat unclear, and based on my correspondence with them, I’m still unsure.
From their website:
[PCBWay Capabilities](https://www.pcbway.com/capabilities.html)
And here is the correspondence:
-What is the minimum solder mask sleeve/bridge (depending on color)?
-white, black, matte black, matte white, these 4 requires min 0.22mm IC spacing, all other colors can do with 0.19mm.
could it really be that large?
Perhaps someone with experience working with them can clarify.
In any case, my original question was about common industry practices, and I’d like to add:
**What are the typical values for the minimum solder mask sliver/bridge in standard PCB manufacturing (nothing special or high-end)?**
To refine my question further:
**At what pitch does a design become too fine for standard manufacturing and require special fabrication processes?**
Additionally, are there alternative solutions? I’ve come across the option of removing the solder mask between pins, but I assume this is not ideal.

Thank you, @Olin, for your response!
Regarding the SM expansion around the pad - this is a good input, I wasn't sure about it.
Regarding SM sliver, I am working with **PCBWay**, and unfortunately, I haven't been able to fully understand their capabilities for the **cheapest board option** (which I assume is their "Standard" service). Their website seems somewhat unclear, and based on my correspondence with them, I’m still unsure.
From their website:
[PCBWay Capabilities](https://www.pcbway.com/capabilities.html)
And here is the correspondence:
-What is the minimum solder mask sleeve/bridge (depending on color)?
-white, black, matte black, matte white, these 4 requires min 0.22mm IC spacing, all other colors can do with 0.19mm.
could it really be that large?
Perhaps someone with experience working with them can clarify.
In any case, my original question was about common industry practices, and I’d like to add:
**What are the typical values for the minimum solder mask sliver/bridge in standard PCB manufacturing (nothing special or high-end)?**
To refine my question further:
**At what pitch does a design become too fine for standard manufacturing and require special fabrication processes?**
Additionally, are there alternative solutions? I’ve come across the option of removing the solder mask between pins, but I assume this is not ideal.

#1: Initial revision by

Eyal78‭ · 2025-01-30T08:42:08Z (about 13 hours ago)

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Thank you, @Olin, for your response!

I am working with **PCBWay**, and unfortunately, I haven't been able to fully understand their capabilities for the **cheapest board option** (which I assume is their "Standard" service). Their website seems somewhat unclear, and based on my correspondence with them, I’m still unsure.

From their website:

[PCBWay Capabilities](https://www.pcbway.com/capabilities.html)

And here is the correspondence:

-What is the minimum solder mask sleeve/bridge (depending on color)?

-white, black, matte black, matte white, these 4 requires min 0.22mm IC spacing, all other colors can do with 0.19mm.


could it really be that large?

Perhaps someone with experience working with them can clarify.



In any case, my original question was about common industry practices, and I’d like to add:

**What are the typical values for the minimum solder mask sliver/bridge in standard PCB manufacturing (nothing special or high-end)?**

To refine my question further:

**At what pitch does a design become too fine for standard manufacturing and require special fabrication processes?**

Additionally, are there alternative solutions? I’ve come across the option of removing the solder mask between pins, but I assume this is not ideal.

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