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Hi, I was watching Many EMC Tips to Help You Design Better PCB Boards (with Keith Armstrong) and at 1:01:30 timestamp he talks about bonding reference plane to chassis and emphasizes that the conn...
#2: Post edited
- Hi,
- I was watching [Many EMC Tips to Help You Design Better PCB Boards (with Keith Armstrong)](https://youtu.be/gHF5JyJF-N4) and at 1:01:30 timestamp he talks about bonding reference plane to chassis and emphasizes that the connection has to be low-impedance and very close:
- My question is the practicality of doing this, how would the assembly process look on the left side pad of the resistor? I imagine the paste would flow all over the mounting hole pad. Here is what I had in mind instead:
- I imagine that leaving a small distance that allows a soldermask dam would only marginally increase the inductance between the pad and the mounting hole, yet make the assembly considerably less challenging.
- Please let me know what you think about these two options and any experience you have regarding this!
- Hi,
- I was watching [Many EMC Tips to Help You Design Better PCB Boards (with Keith Armstrong)](https://youtu.be/gHF5JyJF-N4) and at 1:01:30 timestamp he talks about bonding reference plane to chassis and emphasizes that the connection has to be low-impedance and very close:
- 
- My question is the practicality of doing this, how would the assembly process look on the left side pad of the resistor? I imagine the paste would flow all over the mounting hole pad. Here is what I had in mind instead:
- 
- I imagine that leaving a small distance that allows a soldermask dam would only marginally increase the inductance between the pad and the mounting hole, yet make the assembly considerably less challenging.
- Please let me know what you think about these two options and any experience you have regarding this!
#1: Initial revision
Assembly challenges for shared pad between mounting hole and resistor
Hi, I was watching [Many EMC Tips to Help You Design Better PCB Boards (with Keith Armstrong)](https://youtu.be/gHF5JyJF-N4) and at 1:01:30 timestamp he talks about bonding reference plane to chassis and emphasizes that the connection has to be low-impedance and very close:  My question is the practicality of doing this, how would the assembly process look on the left side pad of the resistor? I imagine the paste would flow all over the mounting hole pad. Here is what I had in mind instead:  I imagine that leaving a small distance that allows a soldermask dam would only marginally increase the inductance between the pad and the mounting hole, yet make the assembly considerably less challenging. Please let me know what you think about these two options and any experience you have regarding this!
