Activity for Eyal78
| Type | On... | Excerpt | Status | Date |
|---|---|---|---|---|
| Comment | Post #293381 |
That completely answers my question (more) |
— | 17 days ago |
| Comment | Post #293379 |
Thanks @Olin, It's a good input for me! (more) |
— | 17 days ago |
| Comment | Post #293382 |
Thank you @Olin! (more) |
— | 17 days ago |
| Edit | Post #293375 |
Post edited: |
— | 2 months ago |
| Comment | Post #293375 |
Everyone who participates in this platform contributes voluntarily, whether by asking questions or answering them. Bringing up consulting rates outside this platform isn’t relevant.
I always do my best to provide as much relevant information as possible, and if something seems missing, it is not d... (more) |
— | 2 months ago |
| Comment | Post #293381 |
Thanks a lot! That does answer my question. I initially thought (according to a professional lecture) that I had to follow method #1. Obviously I didn't understand it correctly. (more) |
— | 2 months ago |
| Edit | Post #293360 |
Post edited: |
— | 2 months ago |
| Comment | Post #293375 |
In this project, there are no formal regulatory or compliance requirements. However, I want to design the board the "right" way—not just to make it work properly, of course.
I'm trying to determine whether I should take all the considerations I've described into account or if this is a relativel... (more) |
— | 2 months ago |
| Comment | Post #293361 |
Please see one more previous comment.
It contains answers for what you've asked and I hope you can answer mine. (more) |
— | 2 months ago |
| Comment | Post #293380 |
In my design the converter isn't a concern. I mentioned it only to give a clue for the PWM signal destination (which is BTW 2 uA load). I hope I did take good care of this part of the layout. But I would like to refer to the listed signals, according to your answer: Is it possible for those signals t... (more) |
— | 2 months ago |
| Edit | Post #293377 |
Post edited: |
— | 2 months ago |
| Edit | Post #293377 | Initial revision | — | 2 months ago |
| Question | — |
Thick trace or a Polygon? Suppose I use a wide trace as a power rail in my circuit (wide enough for the rated current, at a certain copper weight), and it doesn’t have an adjacent ground plane. If I have enough space on the board, is there any advantage to expanding the trace into a polygon? (more) |
— | 2 months ago |
| Comment | Post #293368 |
Thank you all for your responses and for the time you’ve dedicated to this discussion. However, I’ve noticed that many of you are strongly insisting on using a 4-layer board, even though that’s not what I was asking about.
In this post, my question was whether it’s better to route the sneaked-in t... (more) |
— | 2 months ago |
| Edit | Post #293375 |
Post edited: |
— | 2 months ago |
| Edit | Post #293375 | Initial revision | — | 2 months ago |
| Question | — |
Does My Circuit Contain High-Speed Signals? My circuit includes the following components: • PIC16 with internal clock, frequency: 32 MHz • ST LED2000 LED driver (a buck converter) with a PWM dimming input. The converter itself isn't a concern regarding this question. I mentioned it only to give a clue for the PWM signal destination. •... (more) |
— | 2 months ago |
| Comment | Post #293361 |
5. Regarding TH components connected to a large plane/polygon, I thought that if there’s no thermal relief, it might be hard to solder them (the solder won’t melt enough), even with wave soldering, and definitely with hand soldering.
From your response, I understand that this is the same risk with S... (more) |
— | 2 months ago |
| Comment | Post #293361 |
4. Regarding capacitor C16 in the first image – is it connected relatively thermally symmetrically to the two polygons? They are not much larger than what you see in the image and are fairly equal in size, with no nearby vias. If so, can the thermal relief be removed?
_This part of the layout was ... (more) |
— | 2 months ago |
| Comment | Post #293361 |
@olin, thank you very much for the detailed response.
There’s a lot of input and information here.
Now I have a few additional comments and questions based on this:
1. My questions are aimed at understanding the correct way to design a PCB. Right now, this is the example I’m working with, ... (more) |
— | 2 months ago |
| Comment | Post #293368 |
Hi Andy,
You mentioned: "**If** you are going to group", But this is exactly my question:
Shall I group the (small as possible) tracks? or is it better to space them out to allow the ground to fully surround them, and there is no reason to try and cluster them?
Just to clarify: These images ... (more) |
— | 2 months ago |
| Comment | Post #293364 |
Thanks a lot! It does answer my question.
My board is 2 layers. I thought it is not necessary to have 4 layers.
Most of the signals in the circuit changes only once in a while, so most of the time they are DC. Other signals are PWM, which is low freq (500Hz), but they are driven by a 32 MHz MCU.
... (more) |
— | 2 months ago |
| Edit | Post #293363 |
Post edited: |
— | 3 months ago |
| Edit | Post #293363 | Initial revision | — | 3 months ago |
| Question | — |
Power polygon and matching ground For power polygon that primarily carry DC, how critical is it that it is located above a ground plane? If it is important, how crucial is it that the polygon completely overlaps the ground plane beneath it? Additionally, if overlap is important, how significant is it that the ground plane remai... (more) |
— | 3 months ago |
| Edit | Post #293360 | Initial revision | — | 3 months ago |
| Question | — |
Signals and plane on the same layer Hi, I’m working on a PCB layout, which is only about the second board I’ve ever designed. I’d appreciate some help with the following issue: This board has two layers: - The top layer is used for signals and power planes. - The bottom layer (shown in the images) is intended to be a ... (more) |
— | 3 months ago |
| Edit | Post #293359 | Initial revision | — | 3 months ago |
| Question | — |
Thermal Relief – Yes or No? In my PCB design, I have 0402 components connected to polygons. To reduce the risk of tombstoning, I connected them using thermal relief. My guiding principle is that if heat dissipation is not symmetrical on both sides of the component, and the component is 0603 or smaller, thermal relief should ... (more) |
— | 3 months ago |
| Edit | Post #293349 | Initial revision | — | 3 months ago |
| Question | — |
Solder mask bridge issue From what I understand, PCB manufacturing has a limitation on the minimum width of the solder resist—it cannot be too thin, typically not less than 5 mil. In many components, including those with a 0.65 mm pitch, the spacing between pads can become smaller than 5 mil. This reduction in spacing is ... (more) |
— | 3 months ago |