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Comments on Signals and plane on the same layer

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Signals and plane on the same layer

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Hi, I’m working on a PCB layout, which is only about the second board I’ve ever designed. I’d appreciate some help with the following issue:

This board has two layers:

  • The top layer is used for signals and power planes.

  • The bottom layer (shown in the images) is intended to be a ground
    plane.

I’ve tried to minimize the number of traces on the ground layer, but in some cases, routing constraints leave no choice.

My question is:

When placing traces on this ground plane, is it better to:

  1. Keep them as tightly packed as possible, grouping them into a concentrated "island" within the ground pour (Image 1)?
  2. Space them out slightly, allowing the ground pour to flow between them, thereby increasing the overall ground area surrounding the traces (Image 2)?

Maybe these images don't demonstrate the issue very well, but I’d love to hear your insights on the best approach anyway.

Image_1 Image 1

Image_2 Image 2

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2 comment threads

Do you have any PDN ripple specs? Load Transient specs?, Step load current? (1 comment)
Your question is vague and unanswerable without knowing risetime, signal impedance, thus tolerance t... (1 comment)
Your question is vague and unanswerable without knowing risetime, signal impedance, thus tolerance t...
TonyStewart‭ wrote 9 days ago

Your question is vague and unanswerable without knowing risetime, signal impedance, thus tolerance to crosstalk capacitance determined by coplanar trace gap. Using thin 5 thou guard tracks between high impedance signals reduces crosstalk.